Parts are received and verified during IQC inspection.
Kit Preparation for release to SMT Production.
SMD Machine Programming.
Stencil Manufacturing.
SMD Machine Setup and Component Loading.
Physical Verification on Machine and Quality Audit.
First Article Approvel.
PC Board Assembly.
Repeat Process for Second Side.
QC and Touch up.
PCB Cleaning.
OQC inspection.
Pre dispatch Inspection and Transfer to Store.
Some of the Key Features are:
Six fully equipped mobile assembly lines.
One fully equipped Pendrive assembly line.
One brand new highly advanced Laser marking and one Blister sealing machine.
One brand new highly advanced SMT line with SPI & AOI machines to support both high/low volume (Total capacity of 1,25,000 CPH) and high variety of components (More than 300 feeders).
The best in class fully automatic solder paste printing complete support for even prototypes for machine assembly thus ensuring NPI (New product introduction) production stability during development stage..
Dual line 3D solder paste inspection system for avoiding the paste printing defects.
The latest flexible high inventory of feeders (more than 200). This ensures then even a board with huge variety of components is machine assembled in a single pass
Complete support for 0201 to 70 mm square chips.
10 Zone lead free compatible reflow ovens for giving the best reflow results.