• SMT- Surface Mount Technology
• 01005, 0201, CCGA, COB, MCM, MEM
• BGA, Micro BGA, POP, Flip Chip SOIC and TSSOP
• 3D-Inline AOI inspection.
• 3D-SPI Inline Inspection .
• Manual Insertion (Through hole).
• Conformal / Lacker coating.
• Software loading (Programming).
• Functional testing.
• Box build.
• Packing.
• Logistics.

Our PCB Assembly Process is as Follows:

• We receive your PCB and Components
• Parts are received and verified during IQC inspection.
• Kit Preparation for release to SMT Production.
• SMD Machine Programming.
• Stencil Manufacturing.
• SMD Machine Setup and Component Loading.
• Physical Verification on Machine and Quality Audit.
• First Article Approvel.
• PC Board Assembly.
• Repeat Process for Second Side.
• QC and Touch up.
• PCB Cleaning.
• OQC inspection.
• Pre dispatch Inspection and Transfer to Store.

Some of the Key Features are:

• Six fully equipped mobile assembly lines.
•  One fully equipped Pendrive assembly line.
• One brand new highly advanced Laser marking and one Blister sealing machine.
• One brand new highly advanced SMT line with SPI & AOI machines to support both high/low volume (Total capacity of 1,25,000 CPH) and high variety of components (More than 300 feeders).
• The best in class fully automatic solder paste printing complete support for even prototypes for machine assembly thus ensuring NPI (New product introduction) production stability during development stage..
•  Dual line 3D solder paste inspection system for avoiding the paste printing defects.
• The latest flexible high inventory of feeders (more than 200). This ensures then even a board with huge variety of components is machine assembled in a single pass
• Complete support for 0201 to 70 mm square chips.
• 10 Zone lead free compatible reflow ovens for giving the best reflow results.

SILIZON EMS specializes in:

• Mid-to-high complexity, mixed technology (SMT+Plated-Through Hole ) Printed Circuit Board Assemblies (PCBAs)
• PCBAs incorporating components not suited for automated assembly processes
• Estimated Annual Volumes (EAVs) in the range of 300 to 30000 PCBAs
• Design for manufacturing

Manufacturing Process

• Surface Mount Technology
• Through Hole Technology
• High Volume
• Low Volume
• Prototype/Rapid Prototype
• Lineside Material Handling
• JIT Component Procurement

Adhesives

• Conformal Coatings – Acrylic
• Conformal Coatings – Polyurethane
• Conformal Coatings – Silicone
• Cyanoacrylate Bonding
• Epoxy Bonding
• Hot Melt Bonding
• Light Curing Technology
• UV Bonding (Plastics Joining)
• UV Curable Acrylic Bonding