PCB Assembly

  • SMT- Surface Mount Technology
  • 01005, 0201, CCGA, COB, MCM, MEM
  • BGA, Micro BGA, POP, Flip Chip SOIC and TSSOP
  • 3D-Inline AOI inspection.
  • 3D-SPI Inline Inspection .
  • Manual Insertion (Through hole).
  • Conformal / Lacker coating.
  • Software loading (Programming).
  • Functional testing.
  • Box build.
  • Packing.
  • Logistics.

Our PCB Assembly Process is as Follows:

  • We receive your PCB and Components
  • Parts are received and verified during IQC inspection.
  • Kit Preparation for release to SMT Production.
  • SMD Machine Programming.
  • Stencil Manufacturing.
  • SMD Machine Setup and Component Loading.
  • Physical Verification on Machine and Quality Audit.
  • First Article Approvel.
  • PC Board Assembly.
  • Repeat Process for Second Side.
  • QC and Touch up.
  • PCB Cleaning.
  • OQC inspection.
  • Pre dispatch Inspection and Transfer to Store.

Some of the Key Features are:

  • Six fully equipped mobile assembly lines.
  •  One fully equipped Pendrive assembly line.
  • One brand new highly advanced Laser marking and one Blister sealing machine.
  • One brand new highly advanced SMT line with SPI & AOI machines to support both high/low volume (Total capacity of 1,25,000 CPH) and high variety of components (More than 300 feeders).
  • The best in class fully automatic solder paste printing complete support for even prototypes for machine assembly thus ensuring NPI (New product introduction) production stability during development stage..
  •  Dual line 3D solder paste inspection system for avoiding the paste printing defects.
  • The latest flexible high inventory of feeders (more than 200). This ensures then even a board with huge variety of components is machine assembled in a single pass
  • Complete support for 0201 to 70 mm square chips.
  • 10 Zone lead free compatible reflow ovens for giving the best reflow results.

SILIZON EMS specializes in:

  • Mid-to-high complexity, mixed technology (SMT+Plated-Through Hole ) Printed Circuit Board Assemblies (PCBAs)
  • PCBAs incorporating components not suited for automated assembly processes
  • Estimated Annual Volumes (EAVs) in the range of 300 to 30000 PCBAs
  • Design for manufacturing

Manufacturing Process

  • Surface Mount Technology
  • Through Hole Technology
  • High Volume
  • Low Volume
  • Prototype/Rapid Prototype
  • Lineside Material Handling
  • JIT Component Procurement

Adhesives

  • Conformal Coatings – Acrylic
  • Conformal Coatings – Polyurethane
  • Conformal Coatings – Silicone
  • Cyanoacrylate Bonding
  • Epoxy Bonding
  • Hot Melt Bonding
  • Light Curing Technology
  • UV Bonding (Plastics Joining)
  • UV Curable Acrylic Bonding